Concepedia

Microstructure and mechanical properties of aluminum–germanium eutectic bonding with polysilicon metallization for microelectromechanical systems (MEMS) packaging

Woo‐Tae Park, Jin‐Wook Jang, T.E. Clare

Scripta Materialia · 2010 · 17 citations · 3 references

DOI

Concepts

References

3

Glass frit bonding: an universal technology for wafer level encapsulation and packaging

Roy Knechtel · Microsystem Technologies · 2005 · 188 citations

, , +16

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Yu Cheng, Wan-Tai Hsu, K. Najafi et al. · Journal of Microelectromechanical Systems · 2002 · 156 citations

, , +14

Microstructures of the eutectic and hypereutectic Al–Ge alloys solidified under different pressures

Rui Xu, Hongsheng Zhao, J. Li et al. · Materials Letters · 2005 · 39 citations

, , +14