Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

Overview of conductive adhesive interconnection technologies for LCDs

Helge Kristiansen, J. Liu · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 167 citations

Engineering, Electrical Engineering, Materials Science +15

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

Engineering, Materials Engineering, Materials Science +17

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 113 citations

Engineering, Materials Engineering, Materials Science +13

Interfacial reactions in Ag-Sn/Cu couples

Sinn-wen Chen, Yee‐Wen Yen · Journal of Electronic Materials · 1999 · 94 citations

Social Sciences, Social Psychology, Collective Behavior +4

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Myung Jin Yim, Jin-Sang Hwang, Kyung W. Paik · International Journal of Adhesion and Adhesives · 2006 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +13