Silicon on insulator material technology

M. Bruel

Electronics Letters

Materials EngineeringMaterials ScienceElectrical EngineeringWafer Scale ProcessingEngineering +13

On the mechanism of the hydrogen-induced exfoliation of silicon

M. K. Weldon, Vittorio Marsico, Yves J. Chabal, +8

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

Materials ScienceSemiconductorsEngineeringCrystalline DefectsHydrogen Transition +12

Mechanism for hydrogen compensation of shallow-acceptor impurities in single-crystal silicon

N. M. Johnson

Physical review. B, Condensed matter

EngineeringChemistrySilicon On InsulatorFollowing Chemical ReactionSemiconductors +15

Hydrogen and helium bubbles in silicon

G. F. Cerofolini

Materials Science and Engineering R Reports

Bubble DynamicEngineeringPhysicsCondensed Matter PhysicsAtomic Physics +4

A “smarter-cut” approach to low temperature silicon layer transfer

Qiaoling Tong, Roland W. Scholz, U. Gösele, +3

Applied Physics Letters

Materials ScienceImplanted Boron PeakElectrical EngineeringSilicon WafersEngineering +12

Orientation dependence of blistering in H-implanted Si

Yi Zheng, S. S. Lau, T. Höchbauer, +5

Journal of Applied Physics

Materials ScienceOrientation DependenceBlistering KineticsIon ImplantationEngineering +8

Mechanically induced Si layer transfer in hydrogen-implanted Si wafers

Kimmo Henttinen, I. Suni, S. S. Lau

Applied Physics Letters

Materials ScienceElectrical EngineeringAfm MeasurementsEngineeringIon Implantation +12

The influence of boron ion implantation on hydrogen blister formation in <i>n</i>-type silicon

T. Höchbauer, K.C. Walter, R. B. Schwarz, +3

Journal of Applied Physics

Materials ScienceComputer Code TrimIon ImplantationBoron NitrideEngineering +7

Beyond “Smart-Cut®” Recent Advances in Layer Transfer for Material Integration

Q-Y. Tong, R.W. Bower

MRS Bulletin

Materials ScienceEngineeringMaterial ProcessingSurface ScienceApplied Physics +4