Electronics Letters · 1995 · 1K citations · 5 references
EngineeringMaterials EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsChip PackagingSemiconductor Device MaterialsSilicon MaterialsThermal Properties Of SemiconductorsWafer BondingHeat Treatment EffectsSiliconSilicon On Insulator MicromachiningSilicon WafersSilicon-on-insulator ProcessingSilicon-on-insulator TechnologyWafer Bonding MaterialsWafer-to-wafer Bonding
A silicon on insulator material technology based on wafer bonding is described, in which a heat treatment induces an in-depth microslicing of one of the two bonded wafers previously implanted with hydrogen. The basic phenomena, and the first physical and electrical characterisations are discussed briefly.
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Distribution of irradiation damage in silicon bombarded with hydrogen
W. K. Chu, R. H. Kastl, R. F. Lever et al. · Physical review. B, Solid state · 1977 · 78 citations
Plasma thinned SOI bonded wafers
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