Reactive diffusion between Pd and Sn at solid-state temperatures

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 485 citations

Natural Sciences, Materials Engineering, Materials Science +10

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 275 citations

Natural Sciences, Materials Engineering, Materials Science +16

Reaction-Diffusion in the Cu–Sn System

Masami Onishi, Hideo Fujibuchi · Transactions of the Japan Institute of Metals · 1975 · 235 citations · Full text

Natural Sciences, Materials Science, Physics +14

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Natural Sciences, Materials Engineering, Materials Science +17

Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings

Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo · Journal of Electronic Materials · 1994 · 192 citations

Natural Sciences, Materials Engineering, Materials Science +16