The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing

Von Mises Stress in Chemical‐Mechanical Polishing Processes

Duo Wang, J. Lee, Karey Holland et al. · Journal of The Electrochemical Society · 1997 · 173 citations

Natural Sciences, Materials Engineering, Materials Science +13

Stress distribution in chemical mechanical polishing

C Srinivasa-Murthy, D Wang, Stephen P. Beaudoin et al. · Thin Solid Films · 1997 · 106 citations

Natural Sciences, Materials Engineering, Materials Science +12

The Effect of Pad Wear on the Chemical Mechanical Polishing of Silicon Wafers

Greg Byrne, Brigid Mullany, Paul Young · CIRP Annals · 1999 · 44 citations

Engineering, Materials Engineering, Materials Science +16

A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation

Guanghui Fu, Abhijit Chandra · Journal of Electronic Materials · 2002 · 38 citations

Engineering, Materials Engineering, Materials Science +14

Effects of Film Stress on the Chemical Mechanical Polishing Process

Wei‐Tsu Tseng, Yiao‐Hsien Wang, Jyh‐Hwa Chin · Journal of The Electrochemical Society · 1999 · 37 citations

Engineering, Materials Engineering, Materials Science +17