Guanghui Fu

A plasticity-based model of material removal in chemical-mechanical polishing (CMP)

Guanghui Fu, Abhijit Chandra, S. Guha et al. · IEEE Transactions on Semiconductor Manufacturing · 2001 · 159 citations

Natural Sciences, Materials Engineering, Materials Science +16

The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing

Guanghui Fu, Abhijit Chandra · Thin Solid Films · 2004 · 41 citations

Engineering, Materials Engineering, Materials Science +14

An analytical dishing and step height reduction model for chemical mechanical planarization (CMP)

Guanghui Fu, Abhijit Chandra · IEEE Transactions on Semiconductor Manufacturing · 2003 · 40 citations

Engineering, Manufacturing Engineering, Materials Science +14

A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation

Guanghui Fu, Abhijit Chandra · Journal of Electronic Materials · 2002 · 38 citations

Engineering, Materials Engineering, Materials Science +14

An Extension of Hertz’s Theory in Contact Mechanics

Guanghui Fu · Journal of Applied Mechanics · 2006 · 33 citations

Engineering, Mechanical Engineering, Physics +15