Karey Holland

Von Mises Stress in Chemical‐Mechanical Polishing Processes

Duo Wang, J. Lee, Karey Holland et al. · Journal of The Electrochemical Society · 1997 · 171 citations

Von Mises Stress, Engineering, Mechanical Engineering +16

Stress distribution in chemical mechanical polishing

C Srinivasa-Murthy, D Wang, Stephen P. Beaudoin et al. · Thin Solid Films · 1997 · 105 citations

Materials Science, Stress Distribution, Engineering +7

Endpoint detection for CMP

T. Bibby, Karey Holland · Journal of Electronic Materials · 1998 · 41 citations

Engineering, Runtime Verification, Program Analysis +9

Submicron wiring technology with tungsten and planarization

Carter Kaanta, W. Cote, John Cronin et al. · 1987 · 28 citations

Electrical Engineering, Complementary Insulator, Engineering +13

Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Yasa Sampurno, L. Borucki, Yun Zhuang et al. · Thin Solid Films · 2008 · 25 citations

Materials Science, Engineering, Mechanical Engineering +2