T. Bibby

Von Mises Stress in Chemical‐Mechanical Polishing Processes

Duo Wang, J. Lee, Karey Holland et al. · Journal of The Electrochemical Society · 1997 · 171 citations

Von Mises Stress, Engineering, Mechanical Engineering +16

Stress distribution in chemical mechanical polishing

C Srinivasa-Murthy, D Wang, Stephen P. Beaudoin et al. · Thin Solid Films · 1997 · 105 citations

Materials Science, Stress Distribution, Engineering +7

Assessment of post-CMP cleaning mechanisms using statistically-designed experiments

G. Zhang, G. M. Burdick, Feng-xian DAI et al. · Thin Solid Films · 1998 · 53 citations

Engineering, Decontamination, Environmental Engineering +9

Endpoint detection for CMP

T. Bibby, Karey Holland · Journal of Electronic Materials · 1998 · 41 citations

Engineering, Runtime Verification, Program Analysis +9

CMP CoO reduction: slurry reprocessing

T. Bibby, J.A.S. Adams, Karey Holland et al. · Thin Solid Films · 1997 · 25 citations

Chemical Engineering, Cmp Coo Reduction, Engineering +6