Yun Zhuang

Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP

Yan Mu, Yun Zhuang, Yasa Sampurno et al. · Microelectronic Engineering · 2016 · 35 citations

Pad Groove Width, Mechanical Engineering, Slurry Utilization Efficiency

A Method for Direct Measurement of Substrate Temperature during Copper CMP

Yasa Sampurno, L. Borucki, Yun Zhuang et al. · Journal of The Electrochemical Society · 2005 · 32 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +24

Effects of AFM tip-based direct and vibration assisted scratching methods on nanogrooves fabrication on a polymer resist

Yanquan Geng, Yongda Yan, Yun Zhuang et al. · Applied Surface Science · 2015 · 31 citations

Materials Science, Engineering, Microfabrication +8

Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging

Ting Sun, Len Borucki, Yun Zhuang et al. · Japanese Journal of Applied Physics · 2010 · 31 citations

Engineering, Microscopy, Conditioner Aggressiveness +24

Characterization of Pad–Wafer Contact and Surface Topography in Chemical Mechanical Planarization Using Laser Confocal Microscopy

Ting Sun, Yun Zhuang, L. Borucki et al. · Japanese Journal of Applied Physics · 2010 · 31 citations

Engineering, Microscopy, Mechanical Engineering +19