Study of Ta–Si–N thin films for use as barrier layer in copper metallizations

Diffusion barriers in thin films

M.−A. Nicolet · Thin Solid Films · 1978 · 681 citations

Materials Science, Engineering, Diffusion Resistance +5

Evaluation of amorphous (Mo, Ta, W)SiN diffusion barriers for 〈Si〉|Cu metallizations

J.S. Reid, E. Kolawa, R. Ruiz et al. · Thin Solid Films · 1993 · 164 citations

Crystallographic and morphological characterization of reactively sputtered Ta, TaN and TaNO thin films

M. Stavrev, D. Fischer, Christian Wenzel et al. · Thin Solid Films · 1997 · 152 citations

Materials Science, Surface Characterization, Material Analysis +7

Barrier properties and failure mechanism of Ta–Si–N thin films for Cu interconnection

Yoon-Jik Lee, Bong-Seok Suh, Myoung Seok Kwon et al. · Journal of Applied Physics · 1999 · 69 citations

Engineering, Cu Interconnection, Thin Film Process Technology +16