Study of Ta–Si–N thin films for use as barrier layer in copper metallizations

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	Year	Citations
Diffusion barriers in thin films M.−A. Nicolet Thin Solid Films Materials ScienceEngineeringDiffusion ResistanceSurface ScienceApplied Physics	1978	681
Evaluation of amorphous (Mo, Ta, W)SiN diffusion barriers for 〈Si〉\|Cu metallizations J.S. Reid, E. Kolawa, R. Ruiz, Thin Solid Films	1993	164
Crystallographic and morphological characterization of reactively sputtered Ta, TaN and TaNO thin films M. Stavrev, D. Fischer, Christian Wenzel, Thin Solid Films Materials ScienceSurface CharacterizationMaterial AnalysisTano Thin FilmsEngineering	1997	152
Barrier properties and failure mechanism of Ta–Si–N thin films for Cu interconnection Yoon-Jik Lee, Bong-Seok Suh, Myoung Seok Kwon, Journal of Applied Physics EngineeringCu InterconnectionThin Film Process TechnologyChemistrySilicon On Insulator	1999	69

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