T. Scherg

Study of Ta–Si–N thin films for use as barrier layer in copper metallizations

D. Fischer, T. Scherg, Jan Bauer et al. · Microelectronic Engineering · 2000 · 47 citations

Materials Science, Engineering, Barrier Layer +9

Reliability considerations for recent Infineon SiC diode releases

Matthias Holz, G. Hultsch, T. Scherg et al. · Microelectronics Reliability · 2007 · 42 citations

Reliability, Electrical Engineering, Engineering +6

Preparation of AlVO4-films for sensor application via a sol-gel/spin-coating technique

B. Leyer, H. Schmelz, H. Göbel et al. · Thin Solid Films · 1997 · 25 citations

Materials Science, Materials Engineering, Engineering +5

Influence of Overgrown Micropipes in the Active Area of SiC Schottky Diodes on Long Term Reliability

Roland Rupp, Michael Treu, P. Türkes et al. · Materials science forum · 2005 · 18 citations

Electrical Engineering, Long Term Reliability, Engineering +12

Studies on the butt-coupling of InGaAsP-waveguides realized with selective area metalorganic vapour phase epitaxy

R. Strzoda, G. Ebbinghaus, T. Scherg et al. · Journal of Crystal Growth · 1995 · 12 citations

Photonics, Engineering, Physics +6