Thermal and electrical stability of TaN x diffusion barriers for Cu metallization

High Rate Thick Film Growth

John A. Thornton · Annual Review of Materials Science · 1977 · 2.1K citations

Materials Science, Metallic Materials, Additive Manufacturing Techniques +10

Topics in applied physics

Richard T. Brown · Proceedings of the IEEE · 1980 · 939 citations

Engineering, Physics, Applied Physics +2

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, P. M. Fryer, C. Cabral et al. · Journal of Applied Physics · 1992 · 445 citations

Engineering, Chemistry, Chemical Deposition +16

Physics of Copper in Silicon

A. A. Istratov, Eicke R. Weber · Journal of The Electrochemical Society · 2002 · 358 citations · Full text

Materials Science, Materials Engineering, Copper Diffusion Barriers +13

Diffusion barrier property of TaN between Si and Cu

Takeo Oku, Eiji Kawakami, Masaki Uekubo et al. · Applied Surface Science · 1996 · 240 citations

Diffusion Barrier Property, Engineering, Physics +5