Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects

Selected failure mechanisms of modern power modules

Mauro Ciappa · Microelectronics Reliability · 2002 · 969 citations

Engineering, Electrical Engineering, Maintenance Engineering +13

Reliability model for Al wire bonds subjected to heel crack failures

S. Ramminger, N. Seliger, G. Wachutka · Microelectronics Reliability · 2000 · 140 citations

Engineering, Materials Engineering, Materials Science +12

On the effect of power cycling stress on IGBT modules

P. Cova, F. Fantini · Microelectronics Reliability · 1998 · 82 citations · Full text

Engineering, Electrical Engineering, Microelectronics +11

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

Bernhard Czerny, M. Lederer, B. Nagl et al. · Microelectronics Reliability · 2012 · 79 citations

Engineering, Electrical Engineering, Materials Science +16

Lifetime calculation for power modules, application and theory of models and counting methods

K. Mainka, M. Thoben, Oliver Schilling · European Conference on Power Electronics and Applications · 2011 · 51 citations

Engineering, Electrical Engineering, Mechanical Engineering +17