Publication | Closed Access
Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions
79
Citations
5
References
2012
Year
Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Igbt ModulesMechanical EngineeringThermomechanical AnalysisThermodynamicsThermal ConductionHeat TransferThermo-mechanical AnalysisOperating ConditionsThermal EngineeringThermal Conductivity
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