Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

Design for reliability of power electronics modules

Hua Lu, C. Bailey, Chunyan Yin · Microelectronics Reliability · 2009 · 185 citations

Engineering, Electrical Engineering, Fault-tolerant Systems +11

2011 IEEE Energy Conversion Congress and Exposition

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Engineering, Electrical Engineering, Energy Systems +11

Power cycling results for different control strategies

Uwe Scheuermann, S.C. Schuler · Microelectronics Reliability · 2010 · 82 citations

Engineering, Electrical Engineering, Energy Management +13

Thermal–mechanical behavior of the bonding wire for a power module subjected to the power cycling test

Te-Heng Hung, S. Chiang, Chih-Ming Huang et al. · Microelectronics Reliability · 2011 · 65 citations

Engineering, Electrical Engineering, Materials Science +17

Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics

G. Khatibi, M. Lederer, Thomas Licht et al. · Procedia Engineering · 2010 · 45 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17