Composite lead-free electronic solders

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

Engineering, Materials Engineering, Materials Science +9

Constitutive relations for tin-based solder joints

Robert Darveaux, K. Banerji · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 469 citations

Natural Sciences, Materials Engineering, Materials Science +17

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Natural Sciences, Materials Engineering, Materials Science +9

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu, Chih Chen, Chien‐Neng Liao et al. · Applied Physics Letters · 1999 · 160 citations

Engineering, Electrical Engineering, Materials Engineering +14