An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC)

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Kaustav Banerjee, S.J. Souri, Pawan Kapur et al. · Proceedings of the IEEE · 2001 · 1K citations

Engineering, Vlsi Design, Device Integration +22

Three-dimensional integrated circuits

Anna W. Topol, Douglas Charles La Tulipe, Liang Shi et al. · IBM Journal of Research and Development · 2006 · 699 citations

Engineering, Device Integration, Stacked Layers +21

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert Patti · Proceedings of the IEEE · 2006 · 589 citations

Engineering, Computer Architecture, Integrated Circuits +19

Four decades of research on thermal contact, gap, and joint resistance in microelectronics

M. M. Yovanovich · IEEE Transactions on Components and Packaging Technologies · 2005 · 353 citations

Engineering, Thermal Contact, Mechanical Engineering +26

Processor Design in 3D Die-Stacking Technologies

Gabriel H. Loh, Yuan Xie, Bryan Black · IEEE Micro · 2007 · 285 citations

Engineering, Computer Architecture, Computer-aided Design +16