RF-MEMS switch with through-silicon via by the molten solder ejection method

MEMS and Si micromachined circuits for high-frequency applications

L.P.B. Katehi, James Harvey, E. R. Brown · IEEE Transactions on Microwave Theory and Techniques · 2002 · 104 citations

Engineering, Electrical Engineering, Antennas +16

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

J. Van Olmen, Cedric Huyghebaert, Jan Coenen et al. · Microelectronic Engineering · 2010 · 79 citations

Engineering, Materials Engineering, Materials Science +16

A Through-Wafer Interconnect in Silicon for RFICs

J.H. Wu, Jörg Scholvin · IEEE Transactions on Electron Devices · 2004 · 67 citations

Engineering, Electrical Engineering, Microelectronics +16

Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Cheng–En Ho, Su-Yueh Tsai, C. R. Kao · IEEE Transactions on Advanced Packaging · 2001 · 53 citations

Natural Sciences, Materials Engineering, Materials Science +15

RF–MEMS wafer-level packaging using through-wafer interconnect

J. Tian, S. Sosin, Jacopo Iannacci et al. · Sensors and Actuators A Physical · 2007 · 34 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +13