Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

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Six cases of reliability study of Pb-free solder joints in electronic packaging technology

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Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

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Characterization of eutectic Sn-Bi solder joints

Z. Mei, J. W. Morris · Journal of Electronic Materials · 1992 · 315 citations

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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 253 citations

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