Japanese Journal of Applied Physics · 2000 · 19 citations · 11 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor MaterialsSurface ScienceSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor SurfacesSurface CleaningSurface ModificationX-ray Photoelectron SpectroscopyContact FormationContact ResistanceGallium Nitride (Gan) MaterialsHydrochloric Acid TreatmentOhmic ContactsSemiconductor Surface PreparationSurface Cleaning EffectsVacuum Annealing
The effect of surface cleaning techniques on the properties of the metal/p-GaN contacts has been studied using X-ray photoelectron spectroscopy (XPS) and I – V measurements. It has been clarified that the contact resistance strongly depends on the amount of the surface residues such as oxygen and carbon just before the electrode deposition. We have also found that the annealing in ultra high vacuum (UHV) is effective to reduce the residues. It has turned out that the combination of the hydrochloric acid and sulfuric acid hydrogen peroxide mixtures cleaning followed by the UHV annealing is promising for the improvement in the contact characteristics.
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GaN: Processing, defects, and devices
S. J. Pearton, J.C. Zolper, R. J. Shul et al. · Journal of Applied Physics · 1999 · 1.8K citations
Low-resistance ohmic contacts to <i>p</i>-type GaN
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Low resistance Pd/Au ohmic contacts to p-type GaN using surface treatment
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Electron escape depths in germanium
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