Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

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Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 363 citations

Engineering, Electrical Engineering, Materials Science +17

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 267 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Iver E. Anderson · Journal of Materials Science Materials in Electronics · 2006 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +14

Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints

Jae-Woong Nah, Kyung W. Paik, Jong-ook Suh et al. · Journal of Applied Physics · 2003 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +15