Sub-30nm via interconnects fabricated using directed self-assembly - Concepedia

Concepedia

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Sub-30nm via interconnects fabricated using directed self-assembly

24

Citations

2

References

2013

Year

Hirokazu Kato, Yuriko Seino, Hiroki Yonemitsu, Masahiro Kanno, Katsutoshi Kobayashi, Ayako Kawanishi, Tsubasa Imamura, Mitsuhiro Omura, Naofumi Nakamura, Tsukasa Azuma

Microelectronic Engineering

Electrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationNanoelectronicsSelf-assemblyApplied PhysicsElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)

References

	Year	Citations

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