Perpendicular Orientation Control without Interfacial Treatment of RAFT-Synthesized High-χ Block Copolymer Thin Films with Sub-10 nm Features Prepared via Thermal Annealing

Ryuichi Nakatani, Hiroki Takano, Alvin Chandra, +14

ACS Applied Materials & Interfaces

Contact hole shrink process using graphoepitaxial directed self-assembly lithography

Yuriko Seino, Hiroki Yonemitsu, Masahiro Kanno, +8

Journal of Micro/Nanolithography MEMS and MOEMS

EngineeringElectron-beam LithographyWet Development ProcessWafer Scale ProcessingBeam Lithography +16

Novel error mode analysis method for graphoepitaxial directed self-assembly lithography based on the dissipative particle dynamics method

Katsuyoshi Kodera, Shimon Maeda, Satoshi Tanaka, +4

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Numerical AnalysisOptical MaterialsEngineeringElectron-beam LithographyMicroscopy +15

Sub-30nm via interconnects fabricated using directed self-assembly

Hirokazu Kato, Yuriko Seino, Hiroki Yonemitsu, +7

Microelectronic Engineering

Electrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Microfabrication +6

Contact hole shrink process using directed self-assembly

Yuriko Seino, Hiroki Yonemitsu, Masahiro Kanno, +8

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

EngineeringMechanical EngineeringWet Development ProcessPolymersChemical Engineering +15

Mechanism of ArF resist-pattern shrinkage in critical-dimension scanning electron microscopy measurement

Tsukasa Azuma, Kenji Chiba, Hideaki Abe, +2

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

EngineeringElectron-beam LithographyMicroscopyChemistryResist Surface +20

Dissipative particle dynamics simulations to optimize contact hole shrink process using graphoepitaxial directed self-assembly

Hiroki Yonemitsu, Yuriko Seino, Hirokazu Kato, +5

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

EngineeringMechanical EngineeringMaterial SimulationNanostructured PolymerPmma Domain +19

Electrical Via Chain Yield for DSA Contact Hole Shrink Process

Hirokazu Katō, Yuriko Seino, Hiroki Yonemitsu, +7

Journal of Photopolymer Science and Technology

Electrical EngineeringEngineeringChain YieldAdvanced Packaging (Semiconductors)Microfabrication +9

Resist edge roughness with reducing pattern size

Eishi Shiobara, Daisuke Kawamura, Kentaro Matsunaga, +4

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Specific ResistanceResistorResist Edge RoughnessMechanical EngineeringAcid Concentration +1

A novel simple sub-15nm line-and-space patterning process flow using directed self-assembly technology

Yuriko Seino, Yusuke Kasahara, Katsutoshi Kobayashi, +10

Microelectronic Engineering

EngineeringMicrofabricationSelf-assemblyMechanical EngineeringFabrication Technique +4