Mitsuhiro Omura

Future of plasma etching for microelectronics: Challenges and opportunities

G. S. Oehrlein, Stephan M. Brandstadter, Robert L. Bruce et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2024 · 103 citations · Full text

Materials Science, Electrical Engineering, Digital Twins +14

High-Performance FinFET with Dopant-Segregated Schottky Source/Drain

A. Kaneko, A. Yagishita, K. Yahashi et al. · 2006 · 53 citations

Low-power Electronics, Propagation Delay Time, Electrical Engineering +10

Sidewall transfer process and selective gate sidewall spacer formation technology for sub-15nm finfet with elevated source/drain extension

A. Kaneko, A. Yagishita, K. Yahashi et al. · 2006 · 44 citations

Electrical Engineering, Engineering, Sidewall Transfer Process +8

Formation mechanism of sidewall striation in high-aspect-ratio hole etching

Mitsuhiro Omura, Jun-ichi Hashimoto, Takahiro ADACHI et al. · Japanese Journal of Applied Physics · 2019 · 40 citations

Engineering, Plasma Processing, Ion Implantation +17

Progress and perspectives in dry processes for nanoscale feature fabrication: fine pattern transfer and high-aspect-ratio feature formation

Taku Iwase, Yoshito Kamaji, Song Kang et al. · Japanese Journal of Applied Physics · 2019 · 33 citations

Engineering, Electron-beam Lithography, Pattern Transfer +21