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Resistive switching characteristics and mechanism of thermally grown WOx thin films
77
Citations
21
References
2011
Year
Materials ScienceSemiconductorsElectrical EngineeringElectronic DevicesClockwise SwitchingEngineeringOxide ElectronicsApplied PhysicsSwitching MechanismSemiconductor MaterialThin Film Process TechnologyResistive Switching CharacteristicsThin FilmsElectrical PropertyThin Film ProcessingWox Thin Films
Resistive switching characteristics of thermally oxidized tungsten thin films and their switching mechanism were investigated, modifying thickness of the active layer (WOx) by varying oxidation conditions. Two types of switching were observed in Pt/WOx/W memory devices. Thinner film (t ≤ 15 nm) exhibits clockwise switching (CWS) with filamentary characteristics, whereas thicker film (t ≥ 25 nm) exhibits counter-clockwise switching (CCWS) with more homogeneous conduction. Both switching modes are highly reliable and show good cycling endurance. The conduction phenomena in two different switching modes were examined. In the case of CWS, the conduction mechanism changes from Schottky emission to ohmic conduction due to the local bypass of Schottky barrier formed at Pt/WOx interface by oxygen vacancies. Contrary to CWS, CCWS showed a completely different conduction mechanism. The high resistance state is dominated by the Schottky emission at low electric field and by Poole–Frenkel emission at high electric field, whereas the low resistance state exhibits the Schottky emission. Different types of switching behavior might be attributed to the non-homogenous defect distribution across the active layer. A possible conduction sketch for two types switching behaviors is also discussed.
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