Texture and phase transformation of sputter-deposited metastable Ta films and multilayers

Tantalum as a diffusion barrier between copper and silicon

Karen Holloway, P. M. Fryer · Applied Physics Letters · 1990 · 261 citations

Engineering, Materials Engineering, Materials Science +17

A NEW STRUCTURE IN TANTALUM THIN FILMS

M. H. Read, Carl Altman · Applied Physics Letters · 1965 · 224 citations

Natural Sciences, Materials Engineering, Materials Science +4

Barriers Against Copper Diffusion into Silicon and Drift Through Silicon Dioxide

Shi‐Qing Wang · MRS Bulletin · 1994 · 195 citations

Engineering, Materials Engineering, Materials Science +14

The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films

L. A. Clevenger, A. Mutscheller, J. M. E. Harper et al. · Journal of Applied Physics · 1992 · 180 citations

Natural Sciences, Materials Engineering, Materials Science +17

On the structure and homogeneity of solid solutions: The limits of conventional X-ray diffraction

C. Michaelsen · Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties · 1995 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +16