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R. Hoogeveen, M. Moske, H. Geisler, +1

Thin Solid Films

Materials ScienceMaterial AnalysisEngineeringPhysicsNanotechnology +7

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H. Geisler, K. O. Schweitz, J. Chevallier, +2

Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties

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Nanotwin formation and its physical properties and effect on reliability of copper interconnects

Di Xu, V. Sriram, Vidvuds Ozoliņš, +8

Microelectronic Engineering

Materials ScienceElectrical EngineeringNanotwin FormationEngineeringElectromigration Technique +11

Depth dependence of ultraviolet curing of organosilicate low-k thin films

Taek‐Soo Kim, Naoto Tsuji, Nathan Kemeling, +5

Journal of Applied Physics

EngineeringGlass MaterialVacuum DeviceSoft MatterGlass-ceramic +15

Analytics and Metrology of Strained Silicon Structures by Raman and Nano-Raman Spectroscopy

M. Hecker, Liang Zhu, Carsten Georgi, +10

AIP conference proceedings

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Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application

Frank Kuechenmeister, D. Breuer, H. Geisler, +5

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Tuning depth profiles of organosilicate films with ultraviolet curing

Taek‐Soo Kim, Naoto Tsuji, Kiyohiro Matsushita, +5

Journal of Applied Physics

Materials ScienceOptical MaterialsBroadband Uv IrradiationEngineeringUv Curing +11

Structural investigations of laser-deposited Fe/Al multilayers

J. Noetzel, K.D. Brand, H. Geisler, +4

Applied Physics A

Materials EngineeringMaterials ScienceAdvanced Laser ProcessingEngineeringApplied Physics +3

CPI challenges to BEOL at 28nm node and beyond

Vivian Ryan, D. Breuer, H. Geisler, +11

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The microstructural development of Ag/Ni multilayers during annealing

K. O. Schweitz, Klaus Rätzke, D. T. Foord, +5

Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties

Materials EngineeringMaterials ScienceSurface CharacterizationMaterial AnalysisEngineering +13