Nanotwin formation and its physical properties and effect on reliability of copper interconnects - Concepedia

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Nanotwin formation and its physical properties and effect on reliability of copper interconnects

33

Citations

22

References

2008

Year

Di Xu, V. Sriram, Vidvuds Ozoliņš, Jenn‐Ming Yang, K. N. Tu, Gery R. Stafford, Carlos Beauchamp, I. Zienert, H. Geisler, Petra Hofmann,

Microelectronic Engineering

Materials ScienceElectrical EngineeringNanotwin FormationEngineeringElectromigration TechniqueNanomaterialsNanotechnologyNanoelectronicsMetallic Functional MaterialApplied PhysicsMetallurgical InteractionMetallic NanomaterialsElectronic PackagingCopper InterconnectsInterconnect (Integrated Circuits)Physical Properties

References

	Year	Citations

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