Gery R. Stafford

Superconformal Electrodeposition of Copper in 500–90 nm Features

Thomas P. Moffat, John E. Bonevich, William Huber et al. · Journal of The Electrochemical Society · 2000 · 402 citations

Materials Science, Electrical Engineering, Copper Oxide Materials +15

Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits

W. J. Boettinger, C. E. Johnson, L.A. Bendersky et al. · Acta Materialia · 2005 · 320 citations

Materials Science, Engineering, Surface Electrochemistry +6

Electrochemistry of Titanium and the Electrodeposition of Al-Ti Alloys in the Lewis Acidic Aluminum Chloride–1-Ethyl-3-methylimidazolium Chloride Melt

Tetsuya Tsuda, Charles L. Hussey, Gery R. Stafford et al. · Journal of The Electrochemical Society · 2003 · 129 citations

Materials Science, Chemical Engineering, Engineering +11

Electrodeposition of Nickel‐Aluminum Alloys from the Aluminum Chloride‐1‐methyl‐3‐ethylimidazolium Chloride Room Temperature Molten Salt

William R. Pitner, Charles L. Hussey, Gery R. Stafford · Journal of The Electrochemical Society · 1996 · 120 citations

Materials Science, Materials Engineering, Chemical Engineering +12

Electrodeposition of Aluminum from the Aluminum Chloride‐1‐Methyl‐3‐ethylimidazolium Chloride Room Temperature Molten Salt + Benzene

Qing Liao, William R. Pitner, Gemma Stewart et al. · Journal of The Electrochemical Society · 1997 · 119 citations

Materials Science, Chemical Engineering, Engineering +11