Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

Metal–metal bonding process using Ag metallo-organic nanoparticles

Eiichi Ide, Shinji Angata, Akio Hirose et al. · Acta Materialia · 2005 · 498 citations

Natural Sciences, Materials Engineering, Materials Science +10

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow · Journal of Alloys and Compounds · 2011 · 384 citations

Natural Sciences, Materials Engineering, Materials Science +12

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Tao Wang, Xu Chen, Guo‐Quan Lu et al. · Journal of Electronic Materials · 2007 · 341 citations

Natural Sciences, Materials Engineering, Materials Science +13

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Z. Zhang, Guo‐Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 216 citations

Natural Sciences, Materials Engineering, Materials Science +17

Advantages and new development of direct bonded copper substrates

J. Schulz‐Harder · Microelectronics Reliability · 2003 · 160 citations

Engineering, Materials Engineering, Materials Science +12