J. Schulz‐Harder

Publications

272

Citations

H-Index

2002

Active since

Affiliations

Laboratoire de Génie Électrique de Grenoble(Current)

J. Schulz‐Harder is an author at Laboratoire de Génie Électrique de Grenoble specializing in electronic packaging, engineering, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringHeat TransferThermal EngineeringMaterial ScienceMicroelectronicsRefrigerationEnergy EfficiencyPower Electronics

Publications per year

2002–2009

Publications

Advantages and new development of direct bonded copper substrates

J. Schulz‐Harder · Microelectronics Reliability · 2003 · 157 citations

Materials Engineering, Materials Science, Engineering +6

Recent developments of direct bonded copper (DBC) substrates for power modules

J. Schulz‐Harder, K. Exel · 2003 · 21 citations

Advanced Packaging, Materials Science, Electrical Engineering +15

Experimental Study of a Pulsating Heat Pipe with Combined Circular and Square Section Channels

M. Vassilev, Yvan Avenas, Christian Schaeffer et al. · Conference record · 2007 · 18 citations · Full text

Engineering, Flat Plate, Liquid Metal Cooling +17

DBC substrates as a base for power MCM's

J. Schulz‐Harder · 2002 · 18 citations

Engineering, Dbc Technology, Mechanical Engineering +19

Advanced DBC (direct bonded copper) substrates for high power and high voltage electronics

J. Schulz‐Harder · 2006 · 15 citations

Partial Discharge, Engineering, Liquid Metal Cooling +20

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