Contact Reliability

Contact Reliability is the ability of a metal-semiconductor junction to maintain its intended electrical and physical performance over time under specified operating conditions, distinguishing it from broader semiconductor reliability by focusing specifically on the stability and degradation mechanisms of the interface between metallic interconnects and semiconductor materials.

336

Publications

11.2K

Citations

1.3K

Authors

317

Institutions

Publications per year

2017–2026

36

Authors

1.3K

  1. MA
    M. Antler

    Ross Laboratories (United States), United States

    5 publications · 364 citations

    5

    h-index

  2. JM
    J.W. McBride

    University of Southampton, United Kingdom

    5 publications · 113 citations

    5

    h-index

  3. MP
    Michael Pecht

    University of Maryland, College Park, United States

    5 publications · 74 citations

    5

    h-index

  4. SD
    S. Demuynck

    IMEC, Belgium

    4 publications · 127 citations

    4

    h-index

  5. ZT
    Zsolt Tökei

    IMEC, Belgium

    3 publications · 56 citations

    3

    h-index

1–5 of 1.3K

Venues

  1. Microelectronics Reliability

    26 publications · 927 citations

    16

    h-index

  2. 15

    h-index

  3. Journal of Applied Physics

    17 publications · 1.1K citations

    15

    h-index

  4. Journal of Electronic Materials

    JEM · 11 publications · 311 citations

    10

    h-index

  5. Thin Solid Films

    9 publications · 394 citations

    9

    h-index

1–5