Sacrificial Layer Etching
Sacrificial Layer Etching is a micromachining technique in which a transient structural layer is selectively removed through chemical or plasma etching to enable the release and mobility of overlying microfabricated components in surface micromachined MEMS devices.
150
Publications
5.3K
Citations
625
Authors
187
Institutions
Publications per year
2017–2026
12
150
Water and Blood Repellent Flexible Tubes
Sasha Hoshian, Esko Kankuri, Robin H. A. Ras et al. · Scientific Reports · 2017 · 221 citations · Full text
Recent advances in silicon etching for MEMS using the ASE™ process
A. Hynes, Hamza Ashraf, Jy Bhardwaj et al. · Sensors and Actuators A Physical · 1999 · 178 citations
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187

University of Twente
Enschede, The Netherlands
8 h-index
30 publications
1.6K citations

KTH Royal Institute of Technology
Stockholm, Sweden
5 h-index
13 publications
530 citations
Centro Nacional de Microelectrónica
Barcelona, Spain
5 h-index
10 publications
227 citations
University of California, Berkeley
Berkeley, United States
4 h-index
10 publications
378 citations
Chalmers University of Technology
Gothenburg, Sweden
4 h-index
16 publications
513 citations
ETH Zurich
Zurich, Switzerland
4 h-index
7 publications
658 citations

National Chung Hsing University
Taichung, Taiwan
3 h-index
6 publications
118 citations
Brigham Young University
Provo, United States
3 h-index
12 publications
368 citations
1–8 of 187
JMM · 24 publications · 1K citations
18
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10 publications · 449 citations
10
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10 publications · 281 citations
9
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9 publications · 682 citations
9
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8 publications · 286 citations
8
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