Mask Alignment

Mask Alignment is a photolithographic process step in semiconductor manufacturing that belongs to the class of pattern transfer techniques, distinguished by its precise superposition of a photomask’s circuit pattern onto a substrate’s resist layer to ensure accurate spatial registration of microfabricated features.

232

Publications

8.9K

Citations

890

Authors

259

Institutions

Publications per year

2017–2026

25

Authors

890

  1. HI
    Henry I. Smith

    Massachusetts Institute of Technology, United States

    9 publications · 284 citations

    9

    h-index

  2. UD
    Uwe D. Zeitner

    Fraunhofer Institute for Applied Optics and Precision Engineering, Germany

    7 publications · 275 citations

    7

    h-index

  3. RV
    Reinhard Voelkel

    Suss Microoptics (Switzerland), Switzerland

    6 publications · 267 citations

    6

    h-index

  4. UV
    Uwe Vogler

    Suss Microoptics (Switzerland), Switzerland

    6 publications · 267 citations

    6

    h-index

  5. LS
    Lorenz Stuerzebecher

    Fraunhofer Institute for Applied Optics and Precision Engineering, Germany

    5 publications · 249 citations

    5

    h-index

1–5 of 890

Venues

  1. 13

    h-index

  2. Journal of Vacuum Science and Technology

    10 publications · 253 citations

    10

    h-index

  3. Applied Optics

    10 publications · 354 citations

    10

    h-index

  4. IEEE Transactions on Electron Devices

    11 publications · 303 citations

    10

    h-index

  5. Sensors and Actuators A Physical

    9 publications · 1.2K citations

    9

    h-index

1–5