Front-end Packaging
Front-End Packaging is a singular academic contribution that constitutes a specific method, model, framework, theory, construct, dataset, task, or metric directly situated within the domain of Chassis Packaging, distinguished by its focus on the initial stage design, integration, and optimization of components at the system's interface level.
4
Publications
186
Citations
19
Authors
4
Institutions
Publications per year
2017–2026
2
Parents
4
Development of integrated 3D radio front-end system-on-package (SOP)
J. Laskar, A. Sutono, C.-H. Lee et al. · 2002 · 31 citations
Progress and challenges of tungsten-filled through-silicon via
Dina H. Triyoso, T.B. Dao, Tom Kropewnicki et al. · 2010 · 12 citations
Jaehyun Choi, Dooseok Choi, Jongwoo Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 12 citations
1–4 of 4
19
1
h-index
1
h-index
1
h-index
1
h-index
1
h-index
1–5 of 19
4

Vanderbilt University
Nashville, United States
1 h-index
1 publications
131 citations
L'Oréal (France)
Clichy, France
1 h-index
1 publications
131 citations
Erasmus University Rotterdam
Rotterdam, The Netherlands
1 h-index
1 publications
131 citations
Georgia Institute of Technology
Atlanta, United States
1 h-index
8 publications
248 citations
Pohang University of Science and Technology
Pohang, South Korea
1 publications
12 citations
Samsung (South Korea)
Seoul, South Korea
1 publications
12 citations
1–6 of 4
JPP&M · 1 publications · 131 citations
1
h-index
1 publications · 12 citations
1–2