Concepedia

Chiplet Interconnects

Chiplet Interconnects is a specialized interconnect architecture that enables high-bandwidth, low-latency communication between modular semiconductor die, or chiplets, integrated within a single package, distinguishing it from traditional on-die or board-level interconnects by its focus on heterogeneous integration and advanced packaging technologies.

56

Publications

2.9K

Citations

363

Authors

77

Institutions

Publications per year

2017–2026

51

Parents

Publications

56

Recent Advances and Trends in Advanced Packaging

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 585 citations

, , +15

Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level

Debendra Das Sharma, Gerald Pasdast, Zhiguo Qian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 177 citations

, , +17

TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O

Mark T. Wade, Erik Anderson, Shahab Ardalan et al. · IEEE Micro · 2020 · 146 citations

, , +17

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 124 citations · Full text

, , +17

Cost-effective design of scalable high-performance systems using active and passive interposers

Dylan Stow, Yuan Xie, Taniya Siddiqua et al. · 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) · 2017 · 105 citations

, , +17

1–5 of 56

Authors

363

  1. DD
    Denis Dutoit

    Commissariat à l'Énergie Atomique et aux Énergies Alternatives, France

    4 publications · 284 citations

    4

    h-index

  2. CF
    César Fuguet

    Commissariat à l'Énergie Atomique et aux Énergies Alternatives, France

    4 publications · 284 citations

    4

    h-index

  3. DY
    Douglas Yu

    Taiwan Semiconductor Manufacturing Company (Taiwan), Taiwan

    4 publications · 109 citations

    4

    h-index

  4. AK
    Avinash Karanth

    Ohio University, United States

    4 publications · 94 citations

    4

    h-index

  5. SA
    Shahab Ardalan

    San Jose State University, United States

    4 publications · 262 citations

    4

    h-index

1–5 of 363

Institutions

77

  1. Intel (United States)

    Santa Clara, United States

    6 h-index

    19 publications

    1.5K citations

  2. Taiwan Semiconductor Manufacturing Company (Taiwan)

    Hsinchu, Taiwan

    6 h-index

    47 publications

    2.6K citations

  3. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    5 h-index

    100 publications

    7.3K citations

  4. George Washington University

    Washington, United States

    4 h-index

    10 publications

    234 citations

  5. CEA Grenoble

    Grenoble, France

    4 h-index

    87 publications

    6.8K citations

  6. Ohio University

    Athens, United States

    4 h-index

    4 publications

    94 citations

  7. Ayar Labs (United States)

    San Francisco, United States

    4 h-index

    61 publications

    5.2K citations

  8. Laboratoire d'Électronique des Technologies de l'Information

    Grenoble, France

    3 h-index

    72 publications

    4.2K citations

1–8 of 77

Venues

  1. IEEE Micro

    5 publications · 256 citations

    5

    h-index

  2. 4

    h-index

  3. IEEE Journal of Solid-State Circuits

    2 publications · 212 citations

    2

    h-index

  4. 2021 IEEE International Electron Devices Meeting (IEDM)

    Conference · 2 publications · 86 citations

    2

    h-index

  5. 2

    h-index

1–5