Concepedia

2.5D Integration

2.5D Integration is a chip packaging technology that integrates multiple semiconductor dies side by side on an interposer within a single package, enabling high-bandwidth communication through vertical interconnects without stacking the dies directly atop one another.

109

Publications

3.8K

Citations

600

Authors

91

Institutions

Publications per year

2017–2026

50

Variants

2.5D Packaging

Parents

Publications

109

Heterogeneous 2.5D integration on through silicon interposer

Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka et al. · Applied Physics Reviews · 2015 · 163 citations · Full text

, , +17

Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps

Kiyoshi Oi, Satoshi Otake, Noriyoshi Shimizu et al. · 2014 · 145 citations

, , +17

Interconnect characteristics of 2.5-D system integration scheme

Yangdong Deng, W. Maly · 2001 · 141 citations

, , +17

An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Chang-Chi Lee, C.-P Hung, Calvin Cheung et al. · 2016 · 134 citations

, , +17

Dry‐etching‐assisted femtosecond laser machining

Xueqing Liu, Qi‐Dai Chen, Kai‐Min Guan et al. · Laser & Photonics Review · 2017 · 105 citations

, , +14

1–5 of 109

Authors

600

  1. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    9 publications · 240 citations

    9

    h-index

  2. VS
    Venky Sundaram

    Georgia Institute of Technology, United States

    7 publications · 186 citations

    7

    h-index

  3. EJ
    Erik Jan Marinissen

    IMEC, Belgium

    6 publications · 240 citations

    6

    h-index

  4. DS
    Dylan Stow

    University of California, Santa Barbara, United States

    5 publications · 268 citations

    5

    h-index

  5. YX
    Yuan Xie

    Pennsylvania State University, United States

    5 publications · 268 citations

    5

    h-index

1–5 of 600

Institutions

91

  1. Georgia Institute of Technology

    Atlanta, United States

    12 h-index

    77 publications

    2.5K citations

  2. IMEC

    Leuven, Belgium

    8 h-index

    43 publications

    1.1K citations

  3. Samsung (South Korea)

    Seoul, South Korea

    8 h-index

    64 publications

    1.3K citations

  4. Agency for Science, Technology and Research

    Singapore, Singapore

    8 h-index

    50 publications

    2.8K citations

  5. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    6 h-index

    40 publications

    2.4K citations

  6. Carnegie Mellon University

    Pittsburgh, United States

    5 h-index

    10 publications

    568 citations

  7. University of California, Santa Barbara

    Santa Barbara, United States

    5 h-index

    21 publications

    974 citations

  8. Institute of Microelectronics

    Singapore, Singapore

    4 h-index

    17 publications

    323 citations

1–8 of 91

Venues

  1. IMAPSource Proceedings

    3 publications · 69 citations

    3

    h-index

  2. IEEE Design and Test

    3 publications · 51 citations

    3

    h-index

  3. 3

    h-index

  4. 2021 IEEE International Electron Devices Meeting (IEDM)

    Conference · 2 publications · 86 citations

    2

    h-index

  5. 2

    h-index

1–5