Matthew Jordan - Concepedia

Author

Matthew Jordan

Sandia National Laboratories ORCID

Also Known As

M. B. Jordan, Matthew B Jordan, Matthew B. Jordan, Matthew Jordan, Siddharth Nair

Publications

298

Citations

H-Index

Concepts

All Affiliations

Sandia National Laboratories Georgia Institute of Technology University of New Mexico Pennsylvania State University

About

Matthew Jordan is an author at Sandia National Laboratories specializing in electrical engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	125
2	Electrical Engineering	5	5	125
3	Applied Physics	3	3	79
4	Materials Science	3	3	79
5	Antenna	2	2	46

Matthew Jordan

Publications

266

Citations

H-Index

Page 1

	Year	Citations
Optimal Bidirectional Rapidly-Exploring Random Trees Matthew Jordan, Alejandro Pérez DSpace@MIT (Massachusetts Institute of Technology)	2013	115
Tutorial on forming through-silicon vias S. L. Burkett, Matthew Jordan, Rebecca Pauline Schmitt, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)	2020	46
Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications Xiaofan Jia, Xingchen Li, Serhat Erdogan, IEEE Transactions on Components Packaging and Manufacturing Technology Wireless CommunicationsElectrical EngineeringEngineeringAntenna TestingEmbedded Die	2023	29
Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection Rebecca Pauline Schmitt, Lyle Alexander Menk, Ehren Baca, Journal of The Electrochemical Society EngineeringIntegrated CircuitsChemical DepositionInterconnect (Integrated Circuits)Endpoint Detection	2020	20
Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications Xiaofan Jia, Xingchen Li, Kyoung‐sik Moon, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Electrical EngineeringRf ModulesEngineeringChip-scale PackageChip On Board	2022	17
Inversion for Thermal Properties with Frequency Domain Thermoreflectance Benjamin Treweek, Volkan Akçelik, Wyatt Hodges, ACS Applied Materials & Interfaces	2024	14
Sub-10µm Pitch Hybrid Direct Bond Interconnect Development for Die-to-Die Hybridization John Mudrick, Jonatan A. Sierra-Suarez, Matthew Jordan, Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringEnable Chip	2019	13
Glass Package With Multiple Embedded Dies for mmWave Applications Xingchen Li, Xiaofan Jia, Joon Woo Kim, IEEE Transactions on Components Packaging and Manufacturing Technology	2024	12

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