Concepedia

Xiaofan Jia

XJ

Statistics

Publications

9

Citations

141

H-Index

9

Active since

2021

Affiliations

Georgia Institute of Technology(Current)

Pennsylvania State University

Sandia National Laboratories

Xiaofan Jia is an author at Georgia Institute of Technology specializing in materials science, engineering, and antenna in package.

Publications per year

2021–2025

9

Publications

9

Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

Xiaofan Jia, Xingchen Li, Serhat Erdogan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2023 · 32 citations · Full text

Engineering, Electrical Engineering, Antennas +13

Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications

Xiaofan Jia, Xingchen Li, Kyoung‐sik Moon et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 19 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Characterization of Chip-to-Package Interconnects for Glass Panel Embedding (GPE) for Sub-THz Wireless Communications

Serhat Erdogan, Siddharth Ravichandran, Xiaofan Jia et al. · 2021 · 17 citations

Engineering, Materials Engineering, Materials Science +17

Glass Package With Multiple Embedded Dies for mmWave Applications

Xingchen Li, Xiaofan Jia, Joon Woo Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2024 · 14 citations

Engineering, Electrical Engineering, Materials Engineering +17

Glass Packaging for 6G Applications

Madhavan Swaminathan, Xingchen Li, Lakshmi Narasimha Vijay Kumar et al. · IEEE Microwave Magazine · 2025 · 14 citations

Engineering, Electrical Engineering, Materials Science +17

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