Lyle Alexander Menk

Tutorial on forming through-silicon vias

S. L. Burkett, Matthew Jordan, Rebecca Pauline Schmitt et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2020 · 46 citations · Full text

Materials Science, Electrical Engineering, Wafer Scale Processing +15

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

Lyle Alexander Menk, D. Josell, Thomas P. Moffat et al. · Journal of The Electrochemical Society · 2018 · 28 citations · Full text

Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

D. Josell, Lyle Alexander Menk, Andrew E Hollowell et al. · Journal of The Electrochemical Society · 2019 · 26 citations · Full text

Engineering, Bottom-up Copper Filling, Chemical Deposition +17

Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs

Lyle Alexander Menk, Ehren Baca, Matthew G. Blain et al. · Journal of The Electrochemical Society · 2018 · 21 citations · Full text

Engineering, Electrode-electrolyte Interface, Chemistry +17

Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection

Rebecca Pauline Schmitt, Lyle Alexander Menk, Ehren Baca et al. · Journal of The Electrochemical Society · 2020 · 20 citations · Full text

Engineering, Integrated Circuits, Chemical Deposition +21