G.W. Ray - Concepedia

Author

G.W. Ray

Hewlett-Packard (United States)

Also Known As

G. Ray, G.W. Ray, Gary Ray, Gary W Ray, Gary W. Ray

Publications

571

Citations

H-Index

Concepts

All Affiliations

Hewlett-Packard (United States)Micro Focus (United States)Stanford SystemX Alliance Advanced Micro Devices (United States)

About

G.W. Ray is an author at Hewlett-Packard (United States) specializing in engineering, electrical engineering, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	15	538
2	Applied Physics	9	9	398
3	Education	1	1	46
4	Natural Sciences	1	1	42
5	Biochemistry	1	1	42

G.W. Ray

Publications

538

Citations

H-Index

Page 1

	Year	Citations
Microstructure and reliability of copper interconnects Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke, IEEE Transactions on Electron Devices EngineeringCvd CuChemical DepositionCvd Cu FilmsInterconnect (Integrated Circuits)	1999	185
Using a statistical metrology framework to identify systematic and random sources of die- and wafer-level ILD thickness variation in CMP processes E. Chang, B.E. Stine, T. Maung, EngineeringVlsi DesignMeasurementIld ThicknessEducation	2002	46
Interlevel Dielectric Failures in Copper/Low-k Structures Glenn Alers, K. Jow, Roey Shaviv, IEEE Transactions on Device and Materials Reliability EngineeringInter-level Dielectric LayersInterconnect (Integrated Circuits)Reliability EngineeringInterlevel Dielectric Failures	2004	44
Kinetics study of the pressure dependence of the BrO + NO2 reaction at 298 K Stanley P. Sander, G.W. Ray, Robert T. Watson The Journal of Physical Chemistry Chemical EngineeringMolecular SciencesPressure DependenceEngineeringBiochemistry	1981	42
Kinetics study of the reactions of nitric oxide with oxygen fluoride, chlorine oxide, bromine oxide, and iodine oxide at 298 K G.W. Ray, Robert T. Watson The Journal of Physical Chemistry AltmetricsChemical EngineeringChlorine OxideEngineeringNitric Oxide	1981	38
Endpoint detection in plasma etching James P. Roland, Paul Marcoux, G.W. Ray, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Electrical EngineeringPlasma ElectronicsEngineeringMicrofabricationPlasma Application	1985	29
Electromigration of submicron Damascene copper interconnects Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke, Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineering	2002	22
Kinetics of the reaction nitric oxide + ozone .fwdarw. nitrogen dioxide + oxygen from 212 to 422 K G.W. Ray, Robert T. Watson The Journal of Physical Chemistry Advanced Oxidation ProcessEngineeringAtmospheric PhotochemistryAir QualityAltmetric Attention Score	1981	20
Barrier-first integration for improved reliability in copper dual damascene interconnects Glenn Alers, R.T. Rozbicki, G. Harm, EngineeringCopper ContaminationChemical DepositionInterconnect (Integrated Circuits)Rf Bias	2004	20
Spin‐On Glass as an Intermediate Layer in a Tri‐Layer Resist Process G.W. Ray, Shiesen Peng, Diane Burriesci, Journal of The Electrochemical Society Materials ScienceSpintronicsEngineeringPhysicsSurface Science	1982	19

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