H. Teng

Publications

Citations

H-Index

2011

Active since

Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)(Current)

H. Teng is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in microelectronics, advanced packaging, and integrated circuits.

Top concepts

EngineeringMicroelectronicsAdvanced PackagingIntegrated CircuitsElectrical EngineeringApplied PhysicsMicrofabricationElectronic PackagingThree-dimensional Heterogeneous Integration3D Printing

Publications per year

2011–2012

Publications

High-aspect ratio through silicon via (TSV) technology

H.B. Chang, H.Y. Chen, Ping‐Chung Kuo et al. · 2012 · 18 citations

Advanced Packaging, High-aspect Ratio, Electrical Engineering +14

An ultra-thin interposer utilizing 3D TSV technology

W.C. Chiou, K.F. Yang, J.L. Yeh et al. · 2012 · 14 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +14

Thinning, stacking, and TSV proximity effects for Poly and High-K/Metal Gate CMOS devices in an advanced 3D integration process

Tien-Yu Lo, M. F. Chen, S. B. Jan et al. · 2012 · 14 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Orthotropic stress field induced by TSV and its impact on device performance

Chao-Ping Hsieh, H. Teng, Shin-Puu Jeng et al. · 2011 · 11 citations

Advanced Packaging, Device Performance Shift, Electrical Engineering +14

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