Chao-Ping Hsieh

Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages

Po-Yao Lin, M.C. Yew, Shu‐Shen Yeh et al. · 2021 · 40 citations

Engineering, Mechanical Engineering, Computer Architecture +20

Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications

Y. J. Lin, Chao-Ping Hsieh, C. H. Yu et al. · 2011 · 22 citations

Pcb Board, Engineering, Mechanical Engineering +20

Next Generation Large Size High Interconnect Density CoWoS-R Package

Chien-Hsun Lee, YH Hu, SM Chen et al. · 2024 · 20 citations

Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps

C. C. Wei, C. H. Yu, Chi‐Hua Tung et al. · 2011 · 18 citations

Engineering, Mechanical Engineering, Integrated Circuits +20

Orthotropic stress field induced by TSV and its impact on device performance

Chao-Ping Hsieh, H. Teng, Shin-Puu Jeng et al. · 2011 · 11 citations

Advanced Packaging, Device Performance Shift, Electrical Engineering +14