Y. J. Lin

Statistics

Publications

Citations

H-Index

Active since

2011

Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)(Current)

Y. J. Lin is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in thermal stress mitigation, fracture toughness, and materials science.

Publications per year

2011–2013

Publications

Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications

Y. J. Lin, Chao-Ping Hsieh, C. H. Yu et al. · 2011 · 22 citations

Agriculture, Materials Engineering, Materials Science +17

High-performance inductors for integrated fan-out wafer level packaging (InFO-WLP)

S. M. Chen, Lei Huang, J. H. Yeh et al. · 2013 · 10 citations

Engineering, Electrical Engineering, Low-power Design +16

1–2 of 2