H.-S. Fu

Thermally Stimulated Capacitance (TSCAP) in <i>p-n</i> Junctions

C. T. Sah, Wai-Wing Chan, H.-S. Fu et al. · Applied Physics Letters · 1972 · 104 citations

Engineering, Electrical Engineering, Materials Science +17

Current and capacitance transient responses of MOS capacitor. I. General theory and applications to initially depleted surface without surface states

C. T. Sah, H.-S. Fu · physica status solidi (a) · 1972 · 59 citations

Engineering, Electrical Engineering, Materials Science +17

Current and capacitance transient responses of MOS capacitor. II. Recombination centers in the surface space charge layer

C. T. Sah, H.-S. Fu · physica status solidi (a) · 1972 · 43 citations

Engineering, Electrical Engineering, Materials Science +17

The Hi-C RAM cell concept

A.F. Tasch, P.K. Chatterjee, H.-S. Fu et al. · IEEE Transactions on Electron Devices · 1978 · 37 citations

Engineering, Computer Engineering, Electrical Engineering +14

A high-speed bipolar technology featuring self-aligned single-poly base and submicrometer emitter contacts

W.M. Huang, C.I. Drowley, P.J. Vande Voorde et al. · IEEE Electron Device Letters · 1990 · 35 citations

Engineering, Electrical Engineering, Microelectronics +13