Wai-Wing Chan

Thermally Stimulated Capacitance (TSCAP) in <i>p-n</i> Junctions

C. T. Sah, Wai-Wing Chan, H.-S. Fu et al. · Applied Physics Letters · 1972 · 104 citations

Engineering, Electrical Engineering, Materials Science +17

Characteristics of thinned backside-illuminated charge-coupled device imagers

S.R. Shortes, Wai-Wing Chan, Walden C. Rhines et al. · Applied Physics Letters · 1974 · 30 citations

Engineering, Electrical Engineering, Materials Science +17

Elimination of Te Inclusions in ${\rm Cd}_{1-x}{\rm Zn}_{x}{\rm Te}$ Crystals by Short-term Thermal Annealing

P. Fochuk, R. Grill, O. Kopach et al. · IEEE Transactions on Nuclear Science · 2012 · 22 citations

Engineering, Materials Engineering, Materials Science +16

Defect Centers in Boron-Implanted Silicon

Wai-Wing Chan, C. T. Sah · Journal of Applied Physics · 1971 · 18 citations

Engineering, Materials Engineering, Materials Science +17

Thermal emission rates and activation energies of electrons and holes at cobalt centers in silicon

L.D. Yau, Wai-Wing Chan, C. T. Sah · physica status solidi (a) · 1972 · 16 citations

Engineering, Electrical Engineering, Materials Science +15