Concepedia

Author

G. Simon

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Also Known As

G. Simon, Gurvan Simon

35

Publications

323

Citations

11

H-Index

48

Concepts

All Affiliations

Commissariat à l'Énergie Atomique et aux Énergies AlternativesCEA GrenobleLaboratoire d'Électronique des Technologies de l'InformationUniversité Grenoble AlpesLaboratoire d'Étude des Microstructures
GS

About

G. Simon is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, microelectronics, and microfabrication.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

9

9

213

2

Applied Physics

4

4

71

3

Computer Engineering

4

4

124

4

Social Sciences

1

1

20

5

Chemical Engineering

1

1

22

G. Simon

×

11

Publications

252

Citations

11

H-Index

YearCitations

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud,

2019

63

Sub-20 nm x-ray nanolithography using conventional mask technologies on monochromatized synchrotron radiation

G. Simon, Anne‐Marie Haghiri‐Gosnet, J. Bourneix,

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

1997

30

A Novel Structure for Backside Protection Against Physical Attacks on Secure Chips or SiP

S. Borel, L. Duperrex, Edouard Deschaseaux,

2018

26

Electroplating: an alternative transfer technology in the 20nm range

G. Simon, Anne‐Marie Haghiri‐Gosnet, F. Carcenac,

Microelectronic Engineering

1997

22

Nanofabrication at a 10 nm length scale: Limits of lift-off and electroplating transfer processes

Anne‐Marie Haghiri‐Gosnet, C. Vieu, G. Simon,

Journal de Physique IV (Proceedings)

1999

20

3D Printing as a New Packaging Approach for MEMS and Electronic Devices

G. Aspar, B. Goubault, Olivier Lebaigue,

2017

20

Innovative wafer-level encapsulation & underfill material for silicon interposer application

C. Ferrandon, A. Jouve, S. Joblot,

2013

19

Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging

G. Parès, Choukri Karoui, Ahmad Hasif Mohd Zaid,

2013

15

Edge diffraction enhanced printability in x-ray nanolithography

Y. Chen, G. Simon, Anne‐Marie Haghiri‐Gosnet,

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

1998

13

High voltage electron beam nanolithography on WO3

F. Carcenac, C. Vieu, Anne‐Marie Haghiri‐Gosnet,

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

1996

13

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