Concepedia

Nokibul Islam

NI

15

Publications

452

Citations

14

H-Index

2004

Active since

Affiliations

Auburn University(Current)

Amkor Technology (United States)

University of Cincinnati

STATS ChipPAC (Singapore)

Nokibul Islam is an author at Auburn University specializing in electronic packaging, engineering, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringReliability EngineeringMechanics Of MaterialsStructural Health MonitoringMicroelectronicsReliabilityMaterial Science

Publications per year

2004–2019

15

Publications

15

Leading indicators-of-failure for prognosis of electronic and MEMS packaging

Pradeep Lall, Nokibul Islam, Kaysar Rahim et al. · 2004 · 68 citations

Engineering, Mechanical Engineering, Diagnosis +21

Feature extraction and damage-precursors for prognostication of lead-free electronics

Pradeep Lall, Madhura Hande, Chandan Bhat et al. · Microelectronics Reliability · 2007 · 63 citations

Materials Engineering, Electrical Engineering, Condition Monitoring +10

Interface Failure in Lead Free Solder Joints

Robert Darveaux, Corey Reichman, Nokibul Islam · 2006 · 60 citations

Engineering, Mechanical Engineering, Solder Joint Array +17

Prognostication and health monitoring of leaded and lead free electronic and MEMS packages in harsh environments

Pradeep Lall, Nokibul Islam, Jeff Suhling · 2005 · 51 citations

Engineering, Mechanical Engineering, Lead Identification +18

Damage mechanics of electronics on metal-backed substrates in harsh environments

Pradeep Lall, Nokibul Islam, T. Shete et al. · 2004 · 31 citations

Engineering, Mechanical Engineering, Electronic Reliability +20

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