T. Shete

Damage mechanics of electronics on metal-backed substrates in harsh environments

Pradeep Lall, Md Nazmul Islam, John L. Evans et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 43 citations

Engineering, Mechanical Engineering, Electronic Reliability +19

Thermal cycling reliability of lead free solders for automotive applications

Jeffrey C. Suhling, H. S. Gale, Wayne Johnson et al. · 2004 · 37 citations

Engineering, Mechanical Engineering, Chip Resistors +19

Thermal cycling reliability of lead‐free chip resistor solder joints

Jeffrey C. Suhling, H. S. Gale, Wayne Johnson et al. · Soldering and Surface Mount Technology · 2004 · 37 citations

Materials Science, Electrical Engineering, Reliability Engineering +13

Damage mechanics of electronics on metal-backed substrates in harsh environments

Pradeep Lall, Nokibul Islam, T. Shete et al. · 2004 · 31 citations

Engineering, Mechanical Engineering, Electronic Reliability +20

System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates

John L. Evans, Pradeep Lall, Roy W. Knight et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 13 citations

Engineering, Mechanical Engineering, Electronic Design +20