Ahmad Khairyanto

Design and development of a 3D scanning MEMS OCT probe using a novel SiOB package assembly

Yi Xu, J. Singh, C.S. Premachandran et al. · Journal of Micromechanics and Microengineering · 2008 · 55 citations

Engineering, Bioengineering, Biomedical Engineering +17

Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking

Won Kyoung Choi, C.S. Premachandran, Ong Siong Chiew et al. · 2009 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +14

A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications

C.S. Premachandran, John H. Lau, Ling Xie et al. · 2008 · 22 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Design, Fabrication, and Assembly of an Optical Biosensor Probe Package for OCT (Optical Coherence Tomography) Application

C.S. Premachandran, Ahmad Khairyanto, Kelvin Chen Wei Sheng et al. · IEEE Transactions on Advanced Packaging · 2009 · 11 citations

Engineering, Bioengineering, Biomedical Engineering +17